يعرض 1 - 10 نتائج من 1,714 نتيجة بحث عن '"viscoelastic model"', وقت الاستعلام: 1.14s تنقيح النتائج
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    دورية أكاديمية
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    دورية أكاديمية
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    دورية أكاديمية

    المؤلفون: Ozaki, R., Kadowaki, K.

    المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 30(3):955-962 Jun, 2023

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    دورية أكاديمية
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    مؤتمر

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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    دورية أكاديمية

    المؤلفون: Ozaki, R., Ochi, K., Yudate, S., Kadowaki, K.

    المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 29(6):2251-2257 Dec, 2022

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    كتاب إلكتروني

    المؤلفون: Nguyen, Quang TuanAff13, Hoang, Thi Thanh NhanAff13, Bui, Van PhuAff13

    المساهمون: di Prisco, Marco, Series EditorAff1, Chen, Sheng-Hong, Series EditorAff2, Vayas, Ioannis, Series EditorAff3, Kumar Shukla, Sanjay, Series EditorAff4, Sharma, Anuj, Series EditorAff5, Kumar, Nagesh, Series EditorAff6, Wang, Chien Ming, Series EditorAff7, Cui, Zhen-Dong, Series EditorAff8, Ha-Minh, Cuong, editorAff9, Pham, Cao Hung, editorAff10, Vu, Hanh T. H., editorAff11, Huynh, Dat Vu Khoa, editorAff12

    المصدر: Proceedings of the 7th International Conference on Geotechnics, Civil Engineering and Structures, CIGOS 2024, 4-5 April, Ho Chi Minh City, Vietnam : Advances in Planning, Architecture and Construction for Sustainable Development. 482:158-165

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    كتاب إلكتروني

    المساهمون: Wu, Wei, Series EditorAff1, Lin, Jia'en, editorAff2

    المصدر: Proceedings of the International Field Exploration and Development Conference 2023 : Volume 2. :637-644