المؤلفون: Leurquin, C., Vandendaele, W., Jaud, M., Lavieville, R., Mohamad, B., Masante, C., Despesse, G., Nowak, E.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(5):3123-3129 May, 2024

المؤلفون: Lall, Pradeep, Jung, Sungmo

المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-10 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Niharika, Thanniru, Charan, Govindu Sai, Prasad, S. Prayag, Kumar, Aylapogu Pramod

المصدر: 2023 International Conference on Advances in Electronics, Communication, Computing and Intelligent Information Systems (ICAECIS) Advances in Electronics, Communication, Computing and Intelligent Information Systems (ICAECIS), 2023 International Conference on. :441-446 Apr, 2023

Relation: 2023 International Conference on Advances in Electronics, Communication, Computing and Intelligent Information Systems (ICAECIS)

المؤلفون: Zhao, J., Chen, B., Liu, N., Zhou, J., Cheng, R., Liu, Y., Han, G.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 44(9):1464-1467 Sep, 2023

المؤلفون: Lall, Pradeep, Jung, Sungmo

المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-10 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Carrara, Sandro^Aff2

المساهمون: Carrara, Sandro^Aff1

المصدر: Bio/CMOS Interfaces and Co-Design. :351-385

المؤلفون: Carrara, Sandro^Aff2

المساهمون: Carrara, Sandro^Aff1

المصدر: Bio/CMOS Interfaces and Co-Design. :311-349

المؤلفون: Wang, Y., Zhang, G., Zhang, S.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 31(7):1-7 Oct, 2021

المؤلفون: Ayman Rouf, Sarah H. Park, Jonathan P. Singer

المصدر: Advanced Materials Interfaces, Vol 11, Iss 12, Pp n/a-n/a (2024)

مصطلحات موضوعية: electrospray deposition, polystyrene, self‐limiting electrospray deposition, voltage bias, Physics, QC1-999, Technology

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2196-7350

URL الوصول: https://doaj.org/article/67192d7c2a17422d830d539d38aa581c

المؤلفون: Bylund, Maria, Andersson, Rickard, Krause, Sascha, Saleem, Amin M, Marknas, Victor, Passalacqua, Elisa, Kabir, M Shafiq, Desmaris, Vincent

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :2139-2144 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)