المؤلفون: Ji, R., Yao, L., Jiao, J., Xu, G., Fu, F., Lin, G., Li, C., Huang, W., Xue, C., Chen, S.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 45(6):948-951 Jun, 2024

المؤلفون: Roderick, Jonathan, Siddiqi, George, Denninghoff, Dan, Berkoh, Daniel, Tai, Joe, Rao, Sunil, Lynch, Jonathan, Clayton, T., Sharifi, Hasan, Kuzmenko, Daniel, Georgieva, Jana, McArthur, Warren, Mirshafieyan, Seyed, Howard, Dave

المصدر: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024 Microwave Symposium - IMS 2024, 2024 IEEE/MTT-S International. :318-321 Jun, 2024

Relation: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024

المؤلفون: Kim, Hojin, Tuchman, Andrew, Tsai, Yu-Hao, Hisamatsu, Toru, Son, Ilseok, Arkalgud, Sitaram

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1633-1638 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Kang, Shuo, Iacovo, Serena, D'have, Koen, Huylenbroeck, Stefaan Van, Orkut Okudur, Oguzhan, Alexeev, Anton, Plach, Thomas, Probst, Gernot, Ding, Taotao, Wimplinger, Markus, Uhrmann, Thomas, Vos, Joeri De, Beyer, Gerald, Beyne, Eric

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :386-393 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Zhang, Boyao, Chew, Soon-Aik, Stucchi, Michele, Dewilde, Sven, Iacovo, Serena, Witters, Liesbeth, Webers, Tomas, Van Sever, Koen, De Vos, Joeri, Miller, Andy, Beyer, Gerald, Beyne, Eric

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :312-318 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Mousa, Bassant, Rezk, Theodora M., Ragai, Hani

المصدر: 2024 14th International Conference on Electrical Engineering (ICEENG) Electrical Engineering (ICEENG), 2024 14th International Conference on. :408-411 May, 2024

Relation: 2024 14th International Conference on Electrical Engineering (ICEENG)

المؤلفون: Jeong, J., Kim, S.K., Suh, Y., Shim, J., Beak, W.J., Choi, S.J., Kim, J.P., Kim, B.H., Geum, D., Kim, J., Kim, S.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(8):4517-4523 Aug, 2024

المؤلفون: Schulze, S., VoB, T., Kruger, P., Wietstruck, M.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(3):519-524 Mar, 2024

المؤلفون: Ma, Kai, Bekiaris, Nikolaos, Hsu, Ching-Hsiang, Xue, Lei, Ramaswami, Sesh, Ding, Taotao, Probst, Gernot, Wernicke, Tobias, Uhrmann, Thomas, Wimplinger, Markus

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :331-336 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Suga, Tadatomo, Otsuka, Kanji

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1737-1741 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)