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1دورية أكاديمية
المصدر: IEEE Transactions on Antennas and Propagation IEEE Trans. Antennas Propagat. Antennas and Propagation, IEEE Transactions on. 72(8):6298-6308 Aug, 2024
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2دورية أكاديمية
المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 45(7):1309-1312 Jul, 2024
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3مؤتمر
المؤلفون: Ju, JeongMin, Whitchurch, Nathan, Yoon, JiYeon, Sohn, EunSook, Park, KyungRok
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :661-664 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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4مؤتمر
المؤلفون: Wu, Jiaqi, Lim, Teck Guan, Gourikutty, Sajay Bhuvanendran Nair, Li, Xin, Liow, Jason Tsung-Yang, Bhattacharya, Surya
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1175-1178 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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5دورية أكاديمية
المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 72(4):2378-2390 Apr, 2024
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6دورية أكاديمية
المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 66(1):281-292 Feb, 2024
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7مؤتمر
المؤلفون: Behrmann, Ole, Lisec, Thomas, Klingbeil, Finn, Kyoushi, Niklas, Gojdka, Bjorn
المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-6 Sep, 2023
Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
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8مؤتمر
المؤلفون: Hsieh, Ming-Che, Zhang, Frank, Zhu, Forest, Liu, Kang, Chua, Linda, Lin, Yaojian, Damalerio, Joel, Goh, Hin Hwa, Chan, Kai Chong, Chen, Zihao
المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-5 Sep, 2023
Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
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9مؤتمر
المؤلفون: Zhuang, Ming-Han, Shih, Chih-Yuan, Lin, Ho-Chuan, Kang, Andrew, Wang, Yu-Po
المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :275-276 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
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10مؤتمر
المؤلفون: Yao, Mengqi, Hao, Xin, Luo, Guoling, Deng, Jie, Wang, Guosheng, Wang, Jiang, Dai, Qian, Chen, Jian, Ke, Zungui, Gong, Chikun
المصدر: 2023 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO) Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 2023 IEEE International Conference on. :114-118 Jul, 2023
Relation: 2023 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)