يعرض 1 - 10 نتائج من 484 نتيجة بحث عن '"wafer-level package"', وقت الاستعلام: 0.94s تنقيح النتائج
  1. 1
    دورية أكاديمية
    A Broadband D-Band Cavity-Backed Coupled-Feed Patch Antenna in Wafer-Level Package Based on Heterogeneous Integrations

    المؤلفون: Wang, X., Xiao, G., Zhao, B., Huang, Y., Xu, Q.

    المصدر: IEEE Transactions on Antennas and Propagation IEEE Trans. Antennas Propagat. Antennas and Propagation, IEEE Transactions on. 72(8):6298-6308 Aug, 2024

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  2. 2
    دورية أكاديمية
    A Single-Chip Wafer-Level Packaged SR-Crossbar RF MEMS Switch Matrix

    المؤلفون: Zhou, W., Sheng, W., Yan, B.

    المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 45(7):1309-1312 Jul, 2024

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  3. 3
    مؤتمر
    Fusing Current Characterization of Various Cu RDL Designs in Wafer Level Packages

    المؤلفون: Ju, JeongMin, Whitchurch, Nathan, Yoon, JiYeon, Sohn, EunSook, Park, KyungRok

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :661-664 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Characterization of 224 Gbps/lambda Interconnects in Co-Packaged Optics for Hyperscale Data Centers and AI/ML Clusters

    المؤلفون: Wu, Jiaqi, Lim, Teck Guan, Gourikutty, Sajay Bhuvanendran Nair, Li, Xin, Liow, Jason Tsung-Yang, Bhattacharya, Surya

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1175-1178 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  5. 5
    دورية أكاديمية
    Planar Asymmetric Fed Interdigital Coupling Antenna-in-Package Using FOWLP Process Operating at 60–90 GHz in Endfire Mode

    المؤلفون: Lee, D., Lee, J., Lee, K., Kim, M., Youn, Y., Song, H., Hong, W.

    المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 72(4):2378-2390 Apr, 2024

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  6. 6
    دورية أكاديمية
    Prediction and Analysis of Radiated EMI From a Wafer-Level Package Based on IC Source Modeling

    المؤلفون: Cho, J.H., Jeong, S., Kim, J., Ihm, J.D.

    المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 66(1):281-292 Feb, 2024

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  7. 7
    مؤتمر
    Gas Permeable Protection Caps for Wafer Level Chip Scale Packaging (WLCSP) of MEMS Environmental Sensors

    المؤلفون: Behrmann, Ole, Lisec, Thomas, Klingbeil, Finn, Kyoushi, Niklas, Gojdka, Bjorn

    المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-6 Sep, 2023

    Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

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  8. 8
    مؤتمر
    Characterizations for eWLB (Embedded Wafer Level Ball Grid Array) Antenna in Molded Package Integrations in 77GHz Automotive Applications

    المؤلفون: Hsieh, Ming-Che, Zhang, Frank, Zhu, Forest, Liu, Kang, Chua, Linda, Lin, Yaojian, Damalerio, Joel, Goh, Hin Hwa, Chan, Kai Chong, Chen, Zihao

    المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-5 Sep, 2023

    Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

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  9. 9
    مؤتمر
    High Speed Signal Design on Fan-Out RDL Interposer for Artificial Intelligence (AI) and Deep Neural Network (DNN) Chiplet Accelerators Application

    المؤلفون: Zhuang, Ming-Han, Shih, Chih-Yuan, Lin, Ho-Chuan, Kang, Andrew, Wang, Yu-Po

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :275-276 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  10. 10
    مؤتمر
    A Highly Compatible and Step-by-step Temporary Bonding and Debonding Strategy for Ultra-thin Wafer Level Package

    المؤلفون: Yao, Mengqi, Hao, Xin, Luo, Guoling, Deng, Jie, Wang, Guosheng, Wang, Jiang, Dai, Qian, Chen, Jian, Ke, Zungui, Gong, Chikun

    المصدر: 2023 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO) Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 2023 IEEE International Conference on. :114-118 Jul, 2023

    Relation: 2023 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)

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