-
1مؤتمر
المؤلفون: Wang, Jun, Xu, Yan, Yuan, Haiyue, Huang, Yuhao, Lu, Jianmin, Chu, Xiuqin
المصدر: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2024 IEEE 28th Workshop on. :1-4 May, 2024
Relation: 2024 IEEE 28th Workshop on Signal and Power Integrity (SPI)
-
2مؤتمر
المصدر: 2023 IEEE/AIAA 42nd Digital Avionics Systems Conference (DASC) Digital Avionics Systems Conference (DASC), 2023 IEEE/AIAA 42nd. :1-6 Oct, 2023
Relation: 2023 IEEE/AIAA 42nd Digital Avionics Systems Conference (DASC)
-
3مؤتمر
المؤلفون: Liu, Hanjiang, Luo, Yaoping, Chen, Buhua, Yang, Yu
المصدر: 2023 IEEE 3rd International Conference on Information Technology, Big Data and Artificial Intelligence (ICIBA) Information Technology, Big Data and Artificial Intelligence (ICIBA), 2023 IEEE 3rd International Conference on. 3:815-818 May, 2023
Relation: 2023 IEEE 3rd International Conference on Information Technology, Big Data and Artificial Intelligence (ICIBA)
-
4دورية أكاديمية
المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 23(19):22270-22276 Oct, 2023
-
5مؤتمر
المؤلفون: Yee, Chang Fei
المصدر: 2023 IEEE International Symposium On Antennas And Propagation (ISAP) Antennas And Propagation (ISAP), 2023 IEEE International Symposium On. :1-2 Oct, 2023
Relation: 2023 IEEE International Symposium On Antennas And Propagation (ISAP)
-
6دورية أكاديمية
المؤلفون: Passigato, FrancescoAff1, IDs11044023098994_cor1, Schramm, Alexander, Diermeyer, Frank, Sorrentino, Silvio, Gordner, Achim, De Felice, Alessandro
المصدر: Multibody System Dynamics. 60(2):233-255
-
7دورية أكاديمية
المؤلفون: K. Sripriyan, M. Karthigha
المصدر: Scientific Reports, Vol 14, Iss 1, Pp 1-14 (2024)
مصطلحات موضوعية: Silk–sisal plain weave fiber mat, Granite-micro-filler, Mechanical properties, Fracture morphology, Damping characteristic, Physical properties, Medicine, Science
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2045-2322
-
8مؤتمر
المؤلفون: Dragan, Maria, Brinaru, Diana, Halunga, Simona
المصدر: 2022 14th International Conference on Communications (COMM) Communications (COMM), 2022 14th International Conference on. :1-6 Jun, 2022
Relation: 2022 14th International Conference on Communications (COMM)
-
9مؤتمر
المؤلفون: Wang, Chin-Hsun, Lu, Ming-Tsun, Huang, Jun-Rui, Chen, Ching-Sheng, Wu, Ruey-Beei
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1851-1857 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
-
10مؤتمر
المؤلفون: Hayashi, Natsuo, Satoh, Takashi, Uehara, Satoshi
المصدر: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) Consumer Electronics - Taiwan (ICCE-Taiwan), 2023 International Conference on. :533-534 Jul, 2023
Relation: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan)