المؤلفون: D, Prianka, Shilpa, G V, Parvin, Hasina, Prerana, B, Gauda, Rajashree

المصدر: 2024 IEEE International Conference on Information Technology, Electronics and Intelligent Communication Systems (ICITEICS) Information Technology, Electronics and Intelligent Communication Systems (ICITEICS), 2024 IEEE International Conference on. :1-5 Jun, 2024

Relation: 2024 IEEE International Conference on Information Technology, Electronics and Intelligent Communication Systems (ICITEICS)

المؤلفون: Nomura, Ryobu, Hashimoto, Masaaki, Kawakami, Taiga, Alasli, Abdulkareem, Nagano, Hosei, Ueno, Ai

المصدر: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2024 IEEE 37th International Conference on. :1194-1197 Jan, 2024

Relation: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Yu, J., Liao, C., Chang, Y., Huang, H., Wang, C., Hung, C.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(2):221-228 Feb, 2024

المؤلفون: Hupe, Anke^{Aff1, Aff2}, Naether, Franziska, Haase, Thorsten^{Aff2, Aff5}, Bruns, Christian, Heß, Jürgen, Dyckmans, Jens, Joergensen, Rainer Georg^{Aff1, IDs11104024069043_cor7}, Wichern, Florian

المصدر: Plant and Soil: An International Journal on Plant-Soil Relationships. :1-12

المؤلفون: Zou, D., Hong, J., Zhao, S., Chen, J., Wu, H., Hu, K., Ma, G., Chen, Y.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(5):646-654 May, 2023

المؤلفون: Mukhopadhyay, Arani, Pal, Anish, Gukeh, Mohamad Jafari, Megaridis, Constantine M.

المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-6 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: S, Kumaravel., M, Nagaraj, G, Bharathiraja.

المصدر: 2023 International Conference on Inventive Computation Technologies (ICICT) Inventive Computation Technologies (ICICT), 2023 International Conference on. :1538-1546 Apr, 2023

Relation: 2023 International Conference on Inventive Computation Technologies (ICICT)

المؤلفون: Hashimoto, M., Kawakami, T., Alasli, A., Nomura, R., Nagano, H., Ueno, A.

المصدر: Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 32(6):519-521 Dec, 2023

المؤلفون: Karunakaran, Prashobh, Karunakaran, Shanthi, Osman, Mohammad Shahril, Haridas, Sreeja, Karunakaran, Prashanth, Karunakaran, Arjun

المصدر: 2022 International Conference on Futuristic Technologies (INCOFT) Futuristic Technologies (INCOFT), 2022 International Conference on. :1-7 Nov, 2022

Relation: 2022 International Conference on Futuristic Technologies (INCOFT)

المؤلفون: Buhawe, Marc Andrei A., Rejuso, Arnold Loudel M., Maderazo, Christian

المصدر: 2022 IEEE 7th International Conference on Information Technology and Digital Applications (ICITDA) Information Technology and Digital Applications (ICITDA), 2022 IEEE 7th International Conference on. :1-8 Nov, 2022

Relation: 2022 IEEE 7th International Conference on Information Technology and Digital Applications (ICITDA)