المؤلفون: Channi, Harpreet Kaur, Sandhu, Ramandeep, Faiz, Mohammad, Islam, Sardar M. N.

المصدر: 2023 3rd Asian Conference on Innovation in Technology (ASIANCON) Innovation in Technology (ASIANCON), 2023 3rd Asian Conference on. :1-5 Aug, 2023

Relation: 2023 3rd Asian Conference on Innovation in Technology (ASIANCON)

المؤلفون: Shrivastava, Monto, Sharma, Kamal

المصدر: 2023 1st International Conference on Cognitive Computing and Engineering Education (ICCCEE) Cognitive Computing and Engineering Education (ICCCEE), 2023 1st International Conference on. :1-5 Apr, 2023

Relation: 2023 1st International Conference on Cognitive Computing and Engineering Education (ICCCEE)

المؤلفون: Shekhar, Shashi, Garg, Hitendra

المصدر: 2023 1st International Conference on Cognitive Computing and Engineering Education (ICCCEE) Cognitive Computing and Engineering Education (ICCCEE), 2023 1st International Conference on. :1-5 Apr, 2023

Relation: 2023 1st International Conference on Cognitive Computing and Engineering Education (ICCCEE)

المؤلفون: Nesterak, Janusz, Szelągowski, Marek^{Aff2, IDs1084502402419x_cor2}, Radziszewski, Przemysław

المصدر: Journal of Intelligent Manufacturing. :1-17

المؤلفون: de Oliveira, Robert Marques, da Cunha Neto, Antonio Rodrigues, Calvelli, João Vitor Barbosa^{Aff1, IDs00128024039435_cor3}, Ferreira, Eric Batista, de Andrade, Marcio Donizetti, Mincato, Ronaldo Luiz, Santos, Breno Régis

المصدر: Bulletin of Environmental Contamination and Toxicology. 113(2)

المؤلفون: Ezzahra, Essaber Fatima, Rachid, Benmoussa, Roland, De Guio

المصدر: 2022 14th International Colloquium of Logistics and Supply Chain Management (LOGISTIQUA) Logistics and Supply Chain Management (LOGISTIQUA), 2022 14th International Colloquium of. :1-6 May, 2022

Relation: 2022 14th International Colloquium of Logistics and Supply Chain Management (LOGISTIQUA)

المؤلفون: Lad, V.H., Patel, D.A., Chauhan, K.A., Patel, K.A.

المصدر: Engineering, Construction and Architectural Management, 2023, Vol. 31, Issue 7, pp. 2952-2976.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/ECAM-11-2021-0997

المؤلفون: Dayanad, G. K.^Aff39, Baliga, Akshatha G.^Aff39, Manjunatha, I. R.^Aff39, Kamath, Bharath H.^Aff39

المساهمون: Angrisani, Leopoldo, Series Editor^Aff1, Arteaga, Marco, Series Editor^Aff2, Chakraborty, Samarjit, Series Editor^Aff3, Chen, Jiming, Series Editor^Aff4, Chen, Shanben, Series Editor^Aff5, Chen, Tan Kay, Series Editor^Aff6, Dillmann, Rüdiger, Series Editor^Aff7, Duan, Haibin, Series Editor^Aff8, Ferrari, Gianluigi, Series Editor^Aff9, Ferre, Manuel, Series Editor^Aff10, Jabbari, Faryar, Series Editor^Aff11, Jia, Limin, Series Editor^Aff12, Kacprzyk, Janusz, Series Editor^Aff13, Khamis, Alaa, Series Editor^Aff14, Kroeger, Torsten, Series Editor^Aff15, Li, Yong, Series Editor^Aff16, Liang, Qilian, Series Editor^Aff17, Martín, Ferran, Series Editor^Aff18, Ming, Tan Cher, Series Editor^Aff19, Minker, Wolfgang, Series Editor^Aff20, Misra, Pradeep, Series Editor^Aff21, Mukhopadhyay, Subhas, Series Editor^Aff22, Ning, Cun-Zheng, Series Editor^Aff23, Nishida, Toyoaki, Series Editor^Aff24, Oneto, Luca, Series Editor^Aff25, Panigrahi, Bijaya Ketan, Series Editor^Aff26, Pascucci, Federica, Series Editor^Aff27, Qin, Yong, Series Editor^Aff28, Seng, Gan Woon, Series Editor^Aff29, Speidel, Joachim, Series Editor^Aff30, Veiga, Germano, Series Editor^Aff31, Wu, Haitao, Series Editor^Aff32, Zamboni, Walter, Series Editor^Aff33, Zhang, Junjie James, Series Editor^Aff34, Tan, Kay Chen, Series Editor^Aff35, Kalya, Shubhakar, editor^Aff36, Kulkarni, Muralidhar, editor^Aff37, Bhat, Subramanya, editor^Aff38

المصدر: Advances in VLSI, Signal Processing, Power Electronics, IoT, Communication and Embedded Systems : Select Proceedings of VSPICE 2022. 1062:77-87

المؤلفون: Anik Vega Vitianingsih, Choirul Ullum, Anastasia Lidya Maukar, Verdi Yasin, Seftin Fitri Ana Wati

المصدر: Jurnal RESTI (Rekayasa Sistem dan Teknologi Informasi), Vol 8, Iss 2, Pp 208-215 (2024)

مصطلحات موضوعية: spatial analysis, residential land suitability, mcdm, wpm method, ahp method, cohend's cappa, Systems engineering, TA168, Information technology, T58.5-58.64

وصف الملف: electronic resource

Relation: http://jurnal.iaii.or.id/index.php/RESTI/article/view/4520; https://doaj.org/toc/2580-0760

URL الوصول: https://doaj.org/article/22defcab77bd45bcbb0b38ab65f94ed5

المؤلفون: Comar, Bradley, Frazier, R. Scott

المصدر: 2021 International Symposium on Networks, Computers and Communications (ISNCC) Networks, Computers and Communications (ISNCC), 2021 International Symposium on. :1-8 Oct, 2021

Relation: 2021 International Symposium on Networks, Computers and Communications (ISNCC)