يعرض 1 - 10 نتائج من 465 نتيجة بحث عن '"write amplification"', وقت الاستعلام: 0.88s تنقيح النتائج
  1. 1
    دورية أكاديمية
    A Hash-Based Clustering System Software for Intermittent Computing Devices With NAND Flash Memory

    المؤلفون: Wu, C., Liu, C., Yu, P.

    المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 43(9):2565-2577 Sep, 2024

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  2. 2
    مؤتمر
    LeanKV: Efficient Garbage Collection for LSM-Based Key-Value Stores on ZNS SSDs through Lifetime-Based SSTable Clustering

    المؤلفون: Xu, Yishun, Jin, Peiquan, Lu, Mingchen, Wang, Xiaoliang

    المصدر: 2023 IEEE 29th International Conference on Parallel and Distributed Systems (ICPADS) ICPADS Parallel and Distributed Systems (ICPADS), 2023 IEEE 29th International Conference on. :1895-1902 Dec, 2023

    Relation: 2023 IEEE 29th International Conference on Parallel and Distributed Systems (ICPADS)

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  3. 3
    مؤتمر
    Learning-based Data Separation for Write Amplification Reduction in Solid State Drives

    المؤلفون: Sun, Penghao, You, Litong, Zheng, Shengan, Zhang, Wanru, Ma, Ruoyan, Yang, Jie, Wang, Guanzhong, Zhu, Feng, Li, Shu, Huang, Linpeng

    المصدر: 2023 60th ACM/IEEE Design Automation Conference (DAC) Design Automation Conference (DAC), 2023 60th ACM/IEEE. :1-6 Jul, 2023

    Relation: 2023 60th ACM/IEEE Design Automation Conference (DAC)

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  4. 4
    دورية أكاديمية
    MTDB: an LSM-tree-based key-value store using a multi-tree structure to improve read performance

    المؤلفون: Lin, XinweiAff1, Aff2, Pan, YubiaoAff1, Aff2, IDs11227024063825_cor2, Feng, Wenjuan, Zhang, Huizhen, Lin, MingweiAff3, IDs11227024063825_cor5

    المصدر: The Journal of Supercomputing: An International Journal of High-Performance Computer Design, Analysis, and Use. 80(16):23995-24025

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  5. 5
    مؤتمر
    Mitigating Write Amplification of Dual-mode Flash Memory

    المؤلفون: Chen, Yi-Shen, Shih, Ying-Jui, Hsieh, Jen-Wei

    المصدر: 2023 20th International SoC Design Conference (ISOCC) SoC Design Conference (ISOCC), 2023 20th International. :243-244 Oct, 2023

    Relation: 2023 20th International SoC Design Conference (ISOCC)

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  6. 6
    دورية أكاديمية
    Tidal-Tree-Mem: Toward Read-Intensive Key-Value Stores With Tidal Structure Based on LSM-Tree

    المؤلفون: Ma, C., Yang, H., Wu, S., Wang, Y., Mao, R.

    المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 42(2):423-436 Feb, 2023

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  7. 7
    دورية أكاديمية
    A Case for Space Compaction of B-Tree Nodes on Flash Storage

    المؤلفون: Lee, B., An, M., Lee, S.

    المصدر: IEEE Access Access, IEEE. 11:38149-38156 2023

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  8. 8
    مؤتمر
    Separation or Not: On Handing Out-of-Order Time-Series Data in Leveled LSM-Tree

    المؤلفون: Kang, Yuyuan, Huang, Xiangdong, Song, Shaoxu, Zhang, Lingzhe, Qiao, Jialin, Wang, Chen, Wang, Jianmin, Feinauer, Julian

    المصدر: 2022 IEEE 38th International Conference on Data Engineering (ICDE) ICDE Data Engineering (ICDE), 2022 IEEE 38th International Conference on. :3340-3352 May, 2022

    Relation: 2022 IEEE 38th International Conference on Data Engineering (ICDE)

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  9. 9
    مؤتمر
    Reducing Write Amplification of LSM-Tree with Block-Grained Compaction

    المؤلفون: Wang, Xiaoliang, Jin, Peiquan, Hua, Bei, Long, Hai, Huang, Wei

    المصدر: 2022 IEEE 38th International Conference on Data Engineering (ICDE) ICDE Data Engineering (ICDE), 2022 IEEE 38th International Conference on. :3119-3131 May, 2022

    Relation: 2022 IEEE 38th International Conference on Data Engineering (ICDE)

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  10. 10
    دورية أكاديمية
    MemUnison: A Racetrack-ReRAM-Combined Pipeline Architecture for Energy-Efficient in-Memory CNNs

    المؤلفون: Wang, J., Liu, J., Wang, D., Zhang, S., Fan, X.

    المصدر: IEEE Transactions on Computers IEEE Trans. Comput. Computers, IEEE Transactions on. 71(12):3281-3294 Dec, 2022

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