Fast and Facile Liquid Metal Printing via Projection Lithography for Highly Stretchable Electronic Circuits.

التفاصيل البيبلوغرافية
العنوان:	Fast and Facile Liquid Metal Printing via Projection Lithography for Highly Stretchable Electronic Circuits.
المؤلفون:	Wu D; Department of Materials Science and Engineering, University of California, Los Angeles (UCLA), Los Angeles, CA, 90095, USA., Wu S; Department of Materials Science and Engineering, University of California, Los Angeles (UCLA), Los Angeles, CA, 90095, USA., Narongdej P; Department of Materials Science and Engineering, University of California, Los Angeles (UCLA), Los Angeles, CA, 90095, USA., Duan S; Department of Materials Science and Engineering, University of California, Los Angeles (UCLA), Los Angeles, CA, 90095, USA., Chen C; Department of Materials Science and Engineering, University of California, Los Angeles (UCLA), Los Angeles, CA, 90095, USA., Yan Y; Department of Materials Science and Engineering, University of California, Los Angeles (UCLA), Los Angeles, CA, 90095, USA., Liu Z; Department of Materials Science and Engineering, University of California, Los Angeles (UCLA), Los Angeles, CA, 90095, USA., Hong W; Department of Materials Science and Engineering, University of California, Los Angeles (UCLA), Los Angeles, CA, 90095, USA., Frenkel I; Department of Materials Science and Engineering, University of California, Los Angeles (UCLA), Los Angeles, CA, 90095, USA., He X; Department of Materials Science and Engineering, University of California, Los Angeles (UCLA), Los Angeles, CA, 90095, USA.
المصدر:	Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2024 Aug; Vol. 36 (34), pp. e2307632. Date of Electronic Publication: 2024 Jan 10.
نوع المنشور:	Journal Article
اللغة:	English
بيانات الدورية:	Publisher: Wiley-VCH Country of Publication: Germany NLM ID: 9885358 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1521-4095 (Electronic) Linking ISSN: 09359648 NLM ISO Abbreviation: Adv Mater Subsets: PubMed not MEDLINE; MEDLINE
أسماء مطبوعة:	Publication: Sept. 3, 1997- : Weinheim : Wiley-VCH Original Publication: Deerfield Beach, FL : VCH Publishers, 1989-
مستخلص:	Soft electronic circuits are crucial for wearable electronics, biomedical technologies, and soft robotics, requiring soft conductive materials with high conductivity, high strain limit, and stable electrical performance under deformation. Liquid metals (LMs) have become attractive candidates with high conductivity and fluidic compliance, while effective manufacturing methods are demanded. Digital light processing (DLP)-based projection lithography is a high-resolution and high-throughput printing technique for primarily polymers and some metals. If LMs can be printed with DLP as well, the entire soft devices can be fabricated by one printer in a streamlined and highly efficient process. Herein, fast and facile DLP-based LM printing is achieved. Simply with 5-10 s of patterned ultraviolet (UV)-light exposure, a highly conductive and stretchable pattern can be printed using a photo-crosslinkable LM particle ink. The printed eutectic gallium indium traces feature high resolution (≈20 µm), conductivity (3 × 10 ⁶ S m ^-1 ), stretchability (≈2500%), and excellent stability (consistent performance at different deformation). Various patterns are printed in diverse material systems for broad applications including stretchable displays, epidermal strain sensors, heaters, humidity sensors, conformal electrodes for electrography, and multi-layer actuators. The facile and scalable process, excellent performance, and diverse applications ensure its broad impact on soft electronic manufacturing. (© 2024 Wiley‐VCH GmbH.)
References:	P. Won, S. Jeong, C. Majidi, S. H. Ko, iScience 2021, 24, 102698. M D. Dickey, Adv. Mater. 2017, 29, 1606425. B. Llerena Zambrano, A F. Renz, T. Ruff, S. Lienemann, K. Tybrandt, J. Vörös, J. Lee, Adv. Healthcare Mater. 2021, 10, 2001397. Z. Rao, F. Ershad, A. Almasri, L. Gonzalez, X. Wu, C. Yu, Adv. Mater. Technol. 2020, 5, 2000233. S I. Rich, R J. Wood, C. Majidi, Nat. Electron. 2018, 1, 102. D. F. Fernandes, C. Majidi, M. Tavakoli, J. Mater. Chem. C 2019, 7, 14035. Z. Huang, Y. Hao, Y. Li, H. Hu, C. Wang, A. Nomoto, T. Pan, Y. Gu, Y. Chen, T. Zhang, W. Li, Y. Lei, N. Kim, C. Wang, L. Zhang, J W. Ward, A. Maralani, X. Li, M F. Durstock, A. Pisano, Y. Lin, S. Xu, Nat. Electron. 2018, 1, 473. J A. Rogers, T. Someya, Y. Huang, Science 2010, 327, 1603. D.‐H. Kim, N. Lu, R. Ma, Y.‐S. Kim, R.‐H. Kim, S. Wang, J. Wu, S. M. Won, H. Tao, A. Islam, K. J. Yu, T.‐I. Kim, R. Chowdhury, M. Ying, L. Xu, M. Li, H.‐J. Chung, H. Keum, M. Mccormick, P. Liu, Y.‐W. Zhang, F. G. Omenetto, Y. Huang, T. Coleman, J. A. Rogers, Science 2011, 333, 833. H. S. Lee, Y. Jo, J. H. Joo, K. Woo, Z. Zhong, S. Jung, Su Y Lee, Y. Choi, S. Jeong, ACS Appl. Mater. Interfaces 2019, 11, 12622. K. Fu, Y. Yao, J. Dai, L. Hu, Adv. Mater. 2017, 29, 1603486. N. Matsuhisa, D. Inoue, P. Zalar, H. Jin, Y. Matsuba, A. Itoh, T. Yokota, D. Hashizume, T. Someya, Nat. Mater. 2017, 16, 834. J. Liang, K. Tong, Q. Pei, Adv. Mater. 2016, 28, 5986. Mi‐S Lee, J. Kim, J. Park, J.‐U. Park, Nanoscale Res. Lett. 2015, 10, 27. Y. Jiang, S. Ji, J. Sun, J. Huang, Y. Li, G. Zou, T. Salim, C. Wang, W. Li, H. Jin, J. Xu, S. Wang, T. Lei, X. Yan, W. Y. X. Peh, S.‐C. Yen, Z. Liu, M. Yu, H. Zhao, Z. Lu, G. Li, H. Gao, Z. Liu, Z. Bao, X. Chen, Nature 2023, 614, 456. Z. Liu, X. Wang, D. Qi, C. Xu, J. Yu, Y. Liu, Y. Jiang, Bo Liedberg, X. Chen, Adv. Mater. 2017, 29, 1603382. Y. Cao, T G. Morrissey, E. Acome, S I. Allec, B M. Wong, C. Keplinger, C. Wang, Adv. Mater. 2017, 29, 1605099. Y. Wang, C. Zhu, R. Pfattner, H. Yan, L. Jin, S. Chen, F. Molina‐Lopez, F. Lissel, J. Liu, N I. Rabiah, Z. Chen, J. W. Chung, C. Linder, M F. Toney, B. Murmann, Z. Bao, Sci. Adv. 2017, 3, e1602076. S.‐Y. Tang, C. Tabor, K. Kalantar‐Zadeh, M D. Dickey, Annu. Rev. Mater. Res. 2021, 51, 381. T V. Neumann, M D. Dickey, Adv. Mater. Technol. 2020, 5, 2000070. Y. Jo, J. H. Hwang, S. S. Lee, Su Y Lee, Y. S. Kim, D.‐G. Kim, Y. Choi, S. Jeong, ACS Appl. Mater. Interfaces 2022, 14, 10747. Y. G. Park, G. Y. Lee, J. Jang, S. M. Yun, E. Kim, J. U. Park, Adv. Healthcare Mater. 2021, 10, 2002280. M. Zadan, C. Chiew, C. Majidi, M. H. Malakooti, Multifunct. Mater. 2021, 4, 012001. L. Tang, J. Shang, X. Jiang, Sci. Adv. 2021, 7, eabe3778. L. Tang, L. Mou, J. Shang, J. Dou, W. Zhang, X. Jiang, Mater. Horiz. 2020, 7, 1186. Li Ding, C. Hang, S. Yang, J. Qi, R. Dong, Y. Zhang, H. Sun, X. Jiang, Nano Lett. 2022, 22, 4482. Y. Li, S. Wang, J. Zhang, X. Ma, S. Cao, Y. Sun, S. Feng, T. Fang, D. Kong, ACS Appl. Mater. Interfaces 2021, 14, 13713. M. Liao, H. Liao, J. Ye, P. Wan, L. Zhang, ACS Appl. Mater. Interfaces 2019, 11, 47358. L.‐C. Jia, Y.‐F. Jin, J.‐W. Ren, L.‐H. Zhao, D.‐X. Yan, Z.‐M. Li, J. Mater. Chem. C 2021, 9, 2904. A. Uppal, M. Ralphs, W. Kong, M. Hart, K. Rykaczewski, R. Y. Wang, ACS Appl. Mater. Interfaces 2019, 12, 2625. N. Lazarus, B. Hanrahan, Adv. Mater. Technol. 2016, 1, 1600130. Y. Wang, Z. Yu, G. Mao, Y. Liu, G. Liu, J. Shang, S. Qu, Q. Chen, R.‐W. Li, Adv. Mater. Technol. 2019, 4, 1800435. S. Xiang, D. Liu, C. Jiang, W. Zhou, D. Ling, W. Zheng, X. Sun, X. Li, Y. Mao, C. Shan, Adv. Funct. Mater. 2021, 31, 2100940. J. Zhang, R. H. Soon, Z. Wei, W. Hu, M. Sitti, Adv. Sci. 2022, 9, 2203730. J. Ye, Y.‐C. Yao, J.‐Y. Gao, S. Chen, P. Zhang, L. Sheng, J. Liu, Soft Rob. 2022, 9, 1098. M. Zadan, D K. Patel, A P. Sabelhaus, J. Liao, A. Wertz, L. Yao, C. Majidi, Adv. Mater. 2022, 34, 2200857. G. Mao, D. Schiller, D. Danninger, B. Hailegnaw, F. Hartmann, T. Stockinger, M. Drack, N. Arnold, M. Kaltenbrunner, Nat. Commun. 2022, 13, 4456. B. Ping, G. Zhou, Z. Zhang, R. Guo, Front. Bioeng. Biotechnol. 2023, 11, 1118812. N. Ochirkhuyag, Y. Isano, K. Inoue, H. Ota, Sens. Diagn. 2023, 2, 290. M. Kim, H. Lim, S. H. Ko, Adv. Sci. 2023, 10, 2205795. X. P. Hao, C. Y. Li, C. W. Zhang, M. Du, Z. Ying, Q. Zheng, Z. L. Wu, Adv. Funct. Mater. 2021, 31, 2105481. T. Lu, L. Finkenauer, J. Wissman, C. Majidi, Adv. Funct. Mater. 2014, 24, 3351. C. W. Park, Y. G. Moon, H. Seong, S. W. Jung, J.‐Y. Oh, B. S. Na, N.‐M. Park, S. S. Lee, S. G. Im, J. B. Koo, ACS Appl. Mater. Interfaces 2016, 8, 15459. Y.‐G. Park, H. Kim, S.‐Y. Park, Ju‐Y Kim, J.‐U. Park, ACS Appl. Mater. Interfaces 2019, 11, 41497. R. Abbasi, M. Mayyas, M B. Ghasemian, F. Centurion, J. Yang, M. Saborio, F.‐M. Allioux, J. Han, J. Tang, M J. Christoe, K. M. Mohibul Kabir, K. Kalantar‐Zadeh, Md. A. Rahim, J. Mater. Chem. C 2020, 8, 7805. Y. Lin, O. Gordon, M. R Khan, N. Vasquez, J. Genzer, M D. Dickey, Lab Chip 2017, 17, 3043. S. Liang, Y. Li, Y. Chen, J. Yang, T. Zhu, D. Zhu, C. He, Y. Liu, S. Handschuh‐Wang, X. Zhou, J. Mater. Chem. C 2017, 5, 1586. C. Xiao, J. Feng, H. Xu, R. Xu, T. Zhou, ACS Appl. Mater. Interfaces 2022, 14, 20000. M. Tavakoli, M. H. Malakooti, H. Paisana, Y. Ohm, D. G. Marques, P. A. Lopes, A. P. Piedade, A. T. de Almeida, C. Majidi, Adv. Mater. 2018, 30, 1801852. J. W. Boley, E L. White, R K. Kramer, Adv. Mater. 2015, 27, 2355. P. A. Lopes, D. F. Fernandes, A F. Silva, D. G. Marques, A T. De Almeida, C. Majidi, M. Tavakoli, ACS Appl. Mater. Interfaces 2021, 13, 14552. C. Ladd, Ju‐H So, J. Muth, M D. Dickey, Adv. Mater. 2013, 25, 5081. R. Guo, T. Li, Z. Wu, C. Wan, J. Niu, W. Huo, H. Yu, X. Huang, ACS Appl. Mater. Interfaces 2022, 14, 37028. R. Guo, X. Sun, S. Yao, M. Duan, H. Wang, J. Liu, Z. Deng, Adv. Mater. Technol. 2019, 4, 1900183. B. Ma, C. Xu, J. Chi, J. Chen, C. Zhao, H. Liu, Adv. Funct. Mater. 2019, 29, 1901370. B E. Kelly, I. Bhattacharya, H. Heidari, M. Shusteff, C M. Spadaccini, H K. Taylor, Science 2019, 363, 1075. X. Wen, B. Zhang, W. Wang, F. Ye, S. Yue, H. Guo, G. Gao, Y. Zhao, Q. Fang, C. Nguyen, X. Zhang, J. Bao, J T. Robinson, P M. Ajayan, J. Lou, Nat. Mater. 2021, 20, 1506. S K. Saha, D. Wang, Vu H. Nguyen, Y. Chang, J S. Oakdale, S.‐C. Chen, Science 2019, 366, 105. J R. Tumbleston, D. Shirvanyants, N. Ermoshkin, R. Janusziewicz, A R. Johnson, D. Kelly, K. Chen, R. Pinschmidt, J P. Rolland, A. Ermoshkin, E T. Samulski, J M. Desimone, Science 2015, 347, 1349. M. Hua, D. Wu, S. Wu, Y. Ma, Y. Alsaid, X. He, ACS Appl. Mater. Interfaces 2021, 13, 12689. D. Wu, J. Song, Z. Zhai, M. Hua, C. Kim, I. Frenkel, H. Jiang, X. He, ACS Appl. Mater. Interfaces 2019, 11, 47468. X. Yang, M. Sun, Y. Bian, X. He, Adv. Funct. Mater. 2019, 29, 1807615. Y. Alsaid, S. Wu, D. Wu, Y. Du, L. Shi, R. Khodambashi, R. Rico, M. Hua, Y. Yan, Y. Zhao, D. Aukes, X. He, Adv. Mater. 2021, 33, 2008235. S.‐Y. Tang, R. Qiao, Acc. Mater. Res. 2021, 2, 966. E J. Markvicka, M D. Bartlett, X. Huang, C. Majidi, Nat. Mater. 2018, 17, 618. C. J. Thrasher, Z. J. Farrell, N. J. Morris, C. L. Willey, C. E. Tabor, Adv. Mater. 2019, 31, 1903864. S. Liu, D S. Shah, R. Kramer‐Bottiglio, Nat. Mater. 2021, 20, 851. T V. Neumann, E G. Facchine, B. Leonardo, S. Khan, M D. Dickey, Soft Matter 2020, 16, 6608. W. Lee, H. Kim, I. Kang, H. Park, J. Jung, H. Lee, H. Park, Ji Su Park, J. M. Yuk, S. Ryu, J.‐W. Jeong, J. Kang, Science 2022, 378, 637. D. Wu, B. Yao, S. Wu, H. Hingorani, Q. Cui, M. Hua, I. Frenkel, Y. Du, T K. Hsiai, X. He, Adv. Mater. 2022, 34, 2201772. W. Zu, Y. Ohm, M. R. Carneiro, M. Vinciguerra, M. Tavakoli, C. Majidi, Adv. Mater. Technol. 2022, 7, 2200534. Z. Ma, Q. Huang, Qi Xu, Q. Zhuang, X. Zhao, Y. Yang, H. Qiu, Z. Yang, C. Wang, Y. Chai, Z. Zheng, Nat. Mater. 2021, 20, 859. S. Zhu, Ju‐H So, R. Mays, S. Desai, W R. Barnes, B. Pourdeyhimi, M D. Dickey, Adv. Funct. Mater. 2013, 23, 2308. K. Parida, G. Thangavel, G. Cai, X. Zhou, S. Park, J. Xiong, P. S. Lee, Nat. Commun. 2019, 10, 2158. H. Li, R. Qiao, T P. Davis, S.‐Y. Tang, Biosensors 2020, 10, 196. Z J. Farrell, C J. Thrasher, A E. Flynn, C E. Tabor, ACS Appl. Nano Mater. 2020, 3, 6297. X. Li, M. Li, J. Xu, J. You, Z. Yang, C. Li, Nat. Commun. 2019, 10, 3514. M. R. Khan, C. Trlica, J.‐H. So, M. Valeri, M. D. Dickey, ACS Appl. Mater. Interfaces 2014, 6, 22467. E. Andrzejewska, in Three‐Dimensional Microfabrication Using Two‐Photon Polymerization: Fundamentals, Technology, and Applications, Elsevier Inc., New York 2016, pp. 62–81. T. T. H. Luu, Z. Jia, A. Kanaev, L. Museur, J. Phys. Chem. B 2020, 124, 6857. N. Désilles, C. Gautrelet, L. Lecamp, P. Lebaudy, C. Bunel, Eur. Polym. J. 2005, 41, 1296. J. E. Park, H. S. Kang, M. Koo, C. Park, Adv. Mater. 2020, 32, 2070277. Y. H. Cho, Y.‐G. Park, S. Kim, J.‐U. Park, Adv. Mater. 2021, 33, 2005805. Y.‐G. Park, I. Yun, W Gi Chung, W. Park, D Ha Lee, J.‐U. Park, Adv. Sci. 2022, 9, 2104623. S. A. Rahman, S. A. Khan, M. M. Rehman, W.‐Y. Kim, Nanomaterials 2022, 12, 1026. M. Hua, S. Wu, Y. Ma, Y. Zhao, Z. Chen, I. Frenkel, J. Strzalka, H. Zhou, X. Zhu, X. He, Nature 2021, 590, 594. S. Wu, M. Hua, Y. Alsaid, Y. Du, Y. Ma, Y. Zhao, C.‐Y. Lo, C. Wang, D. Wu, B. Yao, J. Strzalka, H. Zhou, X. Zhu, X. He, Adv. Mater. 2021, 33, 2007829. D. Sun, J. Zhang, H. Li, Z. Shi, Qi Meng, S. Liu, J. Chen, X. Liu, Polymers 2021, 13, 1889. Y. Yan, Y. Zhao, Y. Alsaid, B. Yao, Y. Zhang, S. Wu, X. He, Adv. Intell. Syst. 2021, 3, 2000234. P. Shi, Y. Zhao, Z. Liu, X. He, J. Compos. Mater. 2022, 57, 633. Y. Zhao, Q. Li, Z. Liu, Y. Alsaid, P. Shi, M. Khalid Jawed, X. He, Sci Robot 2023, 8, eadf4753.
فهرسة مساهمة:	Keywords: eutectic gallium indium; liquid metal; projection lithography; soft electronics; stretchable circuit
تواريخ الأحداث:	Date Created: 20231221 Latest Revision: 20240821
رمز التحديث:	20240822
DOI:	10.1002/adma.202307632
PMID:	38126914
قاعدة البيانات:	MEDLINE

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تدمد:	1521-4095
DOI:	10.1002/adma.202307632