مؤتمر
The impact of high glass transition temperature of molding compounds on power package warpage and stress performance.
| العنوان: | The impact of high glass transition temperature of molding compounds on power package warpage and stress performance. |
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| المؤلفون: | Ge, Dandong, Subramanian, N. R., Yong, Khai Seen, Foo, Mun Yee, Gan, Swee Lee |
| المصدر: | 2015 IEEE 17th Electronics Packaging & Technology Conference (EPTC); 1/1/2015, p1-6, 6p |
| قاعدة البيانات: | Complementary Index |
Full Text Finder | ردمك: | 9781467372695 |
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| DOI: | 10.1109/EPTC.2015.7412356 |