دورية أكاديمية
Advancing Monolayer 2-D nMOS and pMOS Transistor Integration From Growth to Van Der Waals Interface Engineering for Ultimate CMOS Scaling.
العنوان: | Advancing Monolayer 2-D nMOS and pMOS Transistor Integration From Growth to Van Der Waals Interface Engineering for Ultimate CMOS Scaling. |
---|---|
المؤلفون: | Dorow, Chelsey, O'Brien, Kevin, Naylor, Carl H., Lee, Sudarat, Penumatcha, Ashish, Hsiao, Andy, Tronic, Tristan, Christenson, Michael, Maxey, Kirby, Zhu, Hui, Oni, Adedapo, Alaan, Urusa, Gosavi, Tanay, Gupta, Arnab Sen, Bristol, Robert, Clendenning, Scott, Metz, Matthew, Avci, Uygar |
المصدر: | IEEE Transactions on Electron Devices; Dec2021, Vol. 68 Issue 12, p6592-6598, 7p |
مصطلحات موضوعية: | METAL oxide semiconductor field-effect transistors, ATOMIC layer deposition, TRANSISTORS, MOLECULAR beam epitaxy, MOORE'S law, MONOMOLECULAR films |
مستخلص: | 2-D-material channels enable ultimate scaling of MOSFET transistors and will help Moore’s Law scaling for years. We demonstrate the state of both n- and p-MOSFETs using monolayer transition metal dichalcogenide (TMD) channels of sub-1 nm thickness and manufacturable CVD, molecular beam epitaxy (MBE), or seeded growth. nMOS devices on transferred MBE MoS2 using novel contact metal show low variation, one of the lowest reported contact resistances (${R}_{\text {c}}$) of 0.4 $\text{k}\Omega \cdot \mu \text{m}$ , low hysteresis, and good subthreshold swing (SS) of 77 mV/dec. pMOS devices using CVD WSe2 show 89 mV/dec SS, best reported for pMOS on grown films, but ON-current remains behind nMOS. We show ${R}_{\text {C}}$ is improved by $5\times $ by using a bake process prior to contact metal deposition. Transfer-free, area-selective seeded growth techniques for WS2 and MoS2 are demonstrated as options for wafer-scale TMD channel growth. WS2 transistors achieve 10 $\mu \text{A}/\mu \text{m}$ ON-current, highest reported on WS2 using seeded growth. A new capacitance method is shown to monitor 2-D material contact interface quality. Gate-oxide interface engineering through metal seeding and atomic layer deposition (ALD) demonstrates that a single 2-D channel material can selectively make pMOS or nMOS transistors, alike Si CMOS, and can also be used as a method to achieve p-type doping. We compare back-gated bare channel devices with dual-gate devices and observe hysteresis-free operation and an improvement in mobility with proper passivation. [ABSTRACT FROM AUTHOR] |
Copyright of IEEE Transactions on Electron Devices is the property of IEEE and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
قاعدة البيانات: | Complementary Index |
كن أول من يترك تعليقا!