Characterization of copper nano structures prepared by DC sputtering on various substrates.

التفاصيل البيبلوغرافية
العنوان: Characterization of copper nano structures prepared by DC sputtering on various substrates.
المؤلفون: Hadi, Iman H., Hassoon, Khaleel I., Jawad, Muslim F.
المصدر: AIP Conference Proceedings; 2022, Vol. 2394 Issue 1, p1-6, 6p
مصطلحات موضوعية: DC sputtering, FIELD emission electron microscopy, GLASS coatings, GRAIN size
مستخلص: Copper nanoparticles on FTO coated glass and Si (p-type) substrates by DC (direct current) sputtering technique have been prepared and investigated in this work. A disk of pure copper target has been used with Ar plasma climate inside the deposition chamber to obtain thinfilms with thicknesses of (120 and 260) nm at (1 and 8) min respectively. The structural and morphological form of Cu nanoparticles in function of different substrates at two different sputtering time has been studied. These properties were investigated via field emission scanning electron microscopy (FESEM) and X-ray diffractometer (XRD). Scherrer's equation has been utilize to determine the grain size of the prepared thinfilms. Results from this study show that the thickness of the prepared thinfilms has been increased with increasing sputtering time for both substrates and the grain size at the same time has been changed from substrate to another. [ABSTRACT FROM AUTHOR]
Copyright of AIP Conference Proceedings is the property of American Institute of Physics and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
قاعدة البيانات: Complementary Index
الوصف
تدمد:0094243X
DOI:10.1063/5.0121142