دورية أكاديمية
Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various Backside Metallization.
| العنوان: | Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various Backside Metallization. |
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| المؤلفون: | Chiang, Meng-Ting, Lee, Pei-Ing, Lin, Ang-Ying, Chuang, Tung-Han |
| المصدر: | International Journal of Manufacturing, Materials & Mechanical Engineering; Jan2024, Vol. 13 Issue 1, p1-11, 11p |
| قاعدة البيانات: | Complementary Index |
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