دورية أكاديمية
The impact of thickness-related grain boundary migration on hole concentration and mobility of p-type transparent conducting CuI films.
| العنوان: | The impact of thickness-related grain boundary migration on hole concentration and mobility of p-type transparent conducting CuI films. |
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| المؤلفون: | Ruibin Xue, Gang Gao, Lei Yang, Liangge Xu, Yumin Zhang, Jiaqi Zhu |
| المصدر: | RSC Advances; 2024, Vol. 14 Issue 13, p9072-9079, 8p |
| قاعدة البيانات: | Complementary Index |
Full Text Finder | تدمد: | 20462069 |
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| DOI: | 10.1039/d4ra00704b |