دورية أكاديمية
Effect of copper in the stabilization of Al/CuO energetic semiconductor bridge.
العنوان: | Effect of copper in the stabilization of Al/CuO energetic semiconductor bridge. |
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المؤلفون: | Li, Chen-Ming, Wang, Kai-Bing, Ji, Xiao-Gang, Dong, Xiao-Fen, Wang, Duan |
المصدر: | Journal of Applied Physics; 5/14/2024, Vol. 135 Issue 18, p1-9, 9p |
مصطلحات موضوعية: | THERMODYNAMICS, IGNITION temperature, COPPER oxide, COPPER, SEMICONDUCTORS, DIFFERENTIAL scanning calorimetry, PLASMA temperature |
مستخلص: | The long-term storage performance of energetic multilayer nanofilms is of great significance for their applications. In this paper, it is proposed to add a 10 nm Cu barrier layer between Al/CuO composite films to increase their storage stability. The Al/CuO composite film and Al/Cu/CuO composite film were aged for 14 days in an environment with a relative humidity of 40% and a temperature of 71 °C. Scanning electron microscopy and differential scanning calorimetry were used to analyze the microstructure and thermodynamic properties of the energetic films before and after aging, and the electrical detonation performance and ignition ability of energy-containing semiconductor bridges were studied. The results indicate that after aging for 14 days in an environment with a relative humidity of 40% and a temperature of 71 °C, the Al layer of the Al/CuO composite film becomes thinner, the Al |
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قاعدة البيانات: | Complementary Index |
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