دورية أكاديمية
Conduction electron scattering and spin-flipping at sputtered Al/Cu Interfaces.
| العنوان: | Conduction electron scattering and spin-flipping at sputtered Al/Cu Interfaces. |
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| المؤلفون: | A. Sharma, N. Theodoropoulou, R. Loloee, W. P. Pratt Jr., J. Bass, J. M. Zhang, M. A. Crimp, D. A. Cullen, David. J. Smith, Kai Liu, Shuai Wang, Ke Xia |
| المصدر: | Journal of Applied Physics; Mar2011, Vol. 109 Issue 5, p053903, 9p, 3 Black and White Photographs, 1 Chart, 8 Graphs |
| مصطلحات موضوعية: | CONDUCTION electrons, ELECTRON scattering, SPUTTERING (Physics), ALUMINUM, COPPER, ELECTRON microscopy |
| مستخلص: | We use two different techniques to derive the two parameters describing conduction electron scattering and spin-flipping at sputtered Al/Cu interfaces in the current-perpendicular-to-plane (CPP) geometry. These parameters are: 2ARAl/Cu, twice the interface specific resistance, where A is the area through which the CPP current flows; and δAl/Cu, which gives the probability P of spin-flipping from P = 1 - exp(-δ). A technique involving simple multilayers, and sample temperature not exceeding room temperature, gives 2ARAl/Cu = 2.3 ± 0.2 fΩm2. A technique involving exchange-biased spin-valves (EBSVs), where the sample is annealed briefly to 453 K, gives 2ARAl/Cu = 2.0 ± 0.15 fΩm2. Averaging the two values, but increasing the uncertainty for reasons explained, gives the best estimate of 2ARAl/Cu = 2.15 ± 0.4 fΩm2. This average is comparable to, but smaller than, the published value of 2ARAl/Cu = 3.6 ± 1 fΩm2 derived from thermal conductance measurements, and larger than our calculated values for interface thicknesses up to 6 monolayers (ML). However, it is similar to our calculated values for an interface thickness of 8 ML. Combining extrapolation of higher temperature bulk diffusion data for Al in Cu and vice-versa, with x-ray and transmission electron microscope (TEM) studies of similarly sputtered multilayers, indicates that such interface thicknesses are possible, especially for annealed multilayers. CPP-magnetoresistance (MR) measurements of the EBSV samples give only very small spin-flipping at the Al/Cu interface-δAl/Cu = 0.05 |
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| قاعدة البيانات: | Complementary Index |
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