دورية
Post SiN Etching Cleaning During Copper and Low K Integration
| العنوان: | Post SiN Etching Cleaning During Copper and Low K Integration |
|---|---|
| المؤلفون: | Beverina, Alessio, Louis, Didier, Arvet, C., Lajoinie, E., Besson, Pascal, Peyne, C., Holmes, Douglas, Maloney, D., Lee, S., Lee, W.M. |
| المصدر: | Diffusion and Defect Data Part B: Solid State Phenomena; January 2001, Vol. 76 Issue: 1 p101-104, 4p |
| مستخلص: | Not Available |
| قاعدة البيانات: | Supplemental Index |
| تدمد: | 10120394 |
|---|---|
| DOI: | 10.4028/www.scientific.net/SSP.76-77.101 |