Novel stress-memorization-technology (SMT) for high electron mobility enhancement of gate last high-k/metal gate devices

التفاصيل البيبلوغرافية
العنوان: Novel stress-memorization-technology (SMT) for high electron mobility enhancement of gate last high-k/metal gate devices
المؤلفون: Kang-ill Seo, Jongwan Choi, Sang-pil Sim, Yangsoo Sohn, Seung-Hun Lee, Kwan-Heum Lee, Si-Young Choi, Chulgi Song, Kyungseok Oh, Junghyun Park, Choongryul Ryu, Tae-Ouk Kwon, Chilhee Chung, Hyun-Jung Lee, Sang Bom Kang, Hee-Kyung Jeon, Wookje Kim, Seok-Hoon Kim, Kwan-Yong Lim, Uihui Kwon, Hong-Sik Yoon, Chung Geun Koh, Jinyeong Cho, Eunha Lee
المصدر: 2010 International Electron Devices Meeting.
بيانات النشر: IEEE, 2010.
سنة النشر: 2010
مصطلحات موضوعية: Stress (mechanics), Materials science, business.industry, Logic gate, Electrical engineering, Optoelectronics, D region, Dislocation, business, Metal gate, High electron, High-κ dielectric, Communication channel
الوصف: High-k/metal gate (HKMG) compatible high performance Source/Drain (S/D) stress-memorization-technology (SMT) is presented. Channel stress generated by SMT can be simulated by using mask-edge dislocation model, which is consistent with the measured actual channel stress. Extremely deep pre-amorphization-implant (PAI) for SMT creates multiple mask-edge dislocations under S/D region, which enhances short-channel mobility by 40∼60%. Finally, more than 10% short channel drive current gain is achieved with additional S/D extension optimization.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::02e6b4230fa3503bbb1506cff204de55
https://doi.org/10.1109/iedm.2010.5703332
رقم الأكسشن: edsair.doi...........02e6b4230fa3503bbb1506cff204de55
قاعدة البيانات: OpenAIRE