A novel vacuum-packaged low-power scanning mirror with inclined 3D-shaped window

التفاصيل البيبلوغرافية
العنوان: A novel vacuum-packaged low-power scanning mirror with inclined 3D-shaped window
المؤلفون: Juergen Hagge, C. Eisermann, Thorsten Giese, B. Wagner, Frank Senger, Hans Joachim Quenzer, Lars Ratzmann, D. Vick, B. Jensen, Ulrich Hofmann, F. Soerensen, O. Schwarzelbach, C. Schroeder, Wolfgang Benecke, Joachim Janes
المصدر: 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.
بيانات النشر: IEEE, 2011.
سنة النشر: 2011
مصطلحات موضوعية: Microelectromechanical systems, Fabrication, Materials science, Silicon, business.industry, chemistry.chemical_element, Forming processes, Laser, law.invention, Optics, chemistry, law, Optoelectronics, Scanning mirror, Wafer, business, Wafer-level packaging
الوصف: MEMS based laser projection is of high interest for automotive head-up displays and dashboard displays, as well as for an increasing number of personal mobile projection applications. These applications require scanning mirrors that offer high scan frequencies and wide scan angles while showing low power consumption. This paper presents a novel low-power high-Q scanning mirror that is vacuum encapsulated on wafer level and thereby exhibits Q-factors exceeding 145,000. A new glass forming process enables fabrication of glass wafers with inclined 3D-shaped windows needed to spatially separate the direct reflex from the projected image.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1b97b35c8c9213eddf25bf3dd7f55290
https://doi.org/10.1109/transducers.2011.5969728
رقم الأكسشن: edsair.doi...........1b97b35c8c9213eddf25bf3dd7f55290
قاعدة البيانات: OpenAIRE