Effects of Electrical Current and External Stress on the Electromigration of Intermetallic Compounds Between the Flip-Chip Solder and Copper Substrate
| العنوان: | Effects of Electrical Current and External Stress on the Electromigration of Intermetallic Compounds Between the Flip-Chip Solder and Copper Substrate |
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| المؤلفون: | Wei-Jhen Chen, Chih-Hui Hsu, Tzu-Ching Chen, Ming-Tzer Lin, Ti-Yuan Wu, Yue-Lin Lee |
| المصدر: | Journal of Electronic Materials. 47:35-48 |
| بيانات النشر: | Springer Science and Business Media LLC, 2017. |
| سنة النشر: | 2017 |
| مصطلحات موضوعية: | 010302 applied physics, Materials science, Metallurgy, Intermetallic, 02 engineering and technology, 021001 nanoscience & nanotechnology, Condensed Matter Physics, 01 natural sciences, Electromigration, Electronic, Optical and Magnetic Materials, Stress (mechanics), Grain growth, Electrical resistivity and conductivity, 0103 physical sciences, Materials Chemistry, Grain boundary diffusion coefficient, Electrical and Electronic Engineering, Electric current, 0210 nano-technology, Flip chip |
| الوصف: | This study investigated the effects of electric current and external stress on electromigration of intermetallic compounds (IMC) between solder and copper substrate. Different samples were tested under three different sets of conditions: (1) thermal aging only, (2) thermal aging with electric current ,where resistivity changes were measured using four-point probe measurements, (3) thermal aging with electric current and external stress provided using a four-point bending apparatus. The micro-structural changes in the samples were observed. The results were closely examined; particularly the coupling effect of electric current and external stress to elucidate the electromigration mechanism, as well as the formation of IMC in the samples. For thermal-aging-only samples, the IMC growth mechanism was controlled by grain boundary diffusion. Meanwhile, for thermal aging and applied electric current samples, the IMC growth mechanism was dominated by volume diffusion and interface reaction. Lastly, the IMC growth mechanism in the electric current and external stress group was dominated by grain boundary diffusion with grain growth. The results reveal that the external stress/strain and electric current play a significant role in the electromigration of copper-tin IMC. The samples exposed to tensile stress have reduced electromigration, while those subjected under compressive stress have enhanced electromigration. |
| تدمد: | 1543-186X 0361-5235 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::44a4a2c6c9aaaff43e6555b187d44eff https://doi.org/10.1007/s11664-017-5685-4 |
| حقوق: | CLOSED |
| رقم الأكسشن: | edsair.doi...........44a4a2c6c9aaaff43e6555b187d44eff |
| قاعدة البيانات: | OpenAIRE |
Find this article in full text from Springer Verlag. | تدمد: | 1543186X 03615235 |
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