Process related yield risk mitigation with in-design pattern replacement for system ICs manufactured at advanced technology nodes

التفاصيل البيبلوغرافية
العنوان: Process related yield risk mitigation with in-design pattern replacement for system ICs manufactured at advanced technology nodes
المؤلفون: Frank E. Gennari, Piyush Pathak, Ya-Chieh Lai, Sangah Lee, Jae-Hyun Kang, Jac Condella, Joong-Won Jeon, Jin Kim, Philippe Hurat, Jaehwan Kim, Shin Byung-Chul
المصدر: Design-Process-Technology Co-optimization for Manufacturability XIV.
بيانات النشر: SPIE, 2020.
سنة النشر: 2020
مصطلحات موضوعية: Set (abstract data type), Optical proximity correction, Computer science, Extreme ultraviolet lithography, Reliability (computer networking), Design pattern, Process (computing), Overhead (computing), Design for manufacturability, Reliability engineering
الوصف: Process and reliability risks have become critically important during mass production at advanced technology nodes even with Extreme Ultraviolet Lithography (EUV) illumination. In this work, we propose a design-for-manufacturability solution using a set of new rules to detect high risk design layout patterns. The proposed methods improve design margins while avoiding area overhead and complex design restrictions. In addition, the proposed method introduces an in-design pattern replacement with automatically generated fixing hints to improve all matched locations with identified patterns.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c74af2a2e8bc634694fb1288e684fbd6
https://doi.org/10.1117/12.2551970
رقم الأكسشن: edsair.doi...........c74af2a2e8bc634694fb1288e684fbd6
قاعدة البيانات: OpenAIRE