Numerical fluidic-chemical multi-physics simulation of a mass production model for electroless plating of fine-pitch interconnections in a microchannel for chip packaging applications
| العنوان: | Numerical fluidic-chemical multi-physics simulation of a mass production model for electroless plating of fine-pitch interconnections in a microchannel for chip packaging applications |
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| المؤلفون: | S.J. Grafner, J.H. Huang, P.S. Shih, V. Renganathan, P.Y. Kung, Y.A. Chen, C.H. Huang, C.H. Chen, C.R. Kao |
| المصدر: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC). |
| بيانات النشر: | IEEE, 2022. |
| سنة النشر: | 2022 |
| URL الوصول: | https://explore.openaire.eu/search/publication?articleId=doi_________::dbfa7dfd94ee4247083de78bacad52f6 https://doi.org/10.1109/eptc56328.2022.10013221 |
| حقوق: | CLOSED |
| رقم الأكسشن: | edsair.doi...........dbfa7dfd94ee4247083de78bacad52f6 |
| قاعدة البيانات: | OpenAIRE |
| الوصف غير متاح. |