Utilizing device stacking for area efficient hardened SOI flip-flop designs

التفاصيل البيبلوغرافية
العنوان: Utilizing device stacking for area efficient hardened SOI flip-flop designs
المؤلفون: J. A. Maharrey, T. D. Loveless, R. C. Quinn, Jeffrey S. Kauppila, Michael W. McCurdy, Lloyd W. Massengill, K. Lilja, Bharat L. Bhuva, Robert A. Reed, Michael L. Alles
المصدر: 2014 IEEE International Reliability Physics Symposium.
بيانات النشر: IEEE, 2014.
سنة النشر: 2014
مصطلحات موضوعية: Materials science, Orders of magnitude (temperature), business.industry, Transistor, Stacking, Electrical engineering, Silicon on insulator, law.invention, Tilt (optics), Soft error, law, Optoelectronics, business, Flip-flop, Order of magnitude
الوصف: D-flip-flop designs hardened with stacked transistors for a 32-nm SOI CMOS technology show greater than three orders of magnitude decrease in soft error cross-section, up to a heavy-ion tested tilt angle of 55°, and greater than one order of magnitude decrease in cross-section for a heavy-ion tested tilt angle of 75° with less than 50% area penalty compared to unhardened D-flip-flop designs.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ef45690ae4337d40e04601f8367692ee
https://doi.org/10.1109/irps.2014.6861176
رقم الأكسشن: edsair.doi...........ef45690ae4337d40e04601f8367692ee
قاعدة البيانات: OpenAIRE