Pressure-less Ag-sinter die attach materials are characterized in the present study using test samples processed to a thickness from 20 to $240\mu \mathrm{m}$ by stencil printing and sintering at 200°C for 1h. For test samples to a thickness from $250\mu \mathrm{m}$ to 7.5mm processed by stacking a few layers of printed Ag-sinter and sintering them at 200°C for 1h. These Ag-sinter test samples are processed to the dimensions required to be evaluated with commercially available test equipment's as per standard test procedures. The measured electrical/thermal/mechanical properties of pressure-less Ag-sinter film/sheet/bar are as follows: 1.electrical sheet resistivity measured using 4-probe method is from 8.5 to $9.5\ \mu\Omega$ . cm 2.thermal conductivity measured using LaTIMA approach is about 150 W/m°K 3.coefficient of thermal expansion (CTE) measured using TMA is 19.4ppm 4.specific heat capacity (Cp) measured using DSC is 0.25 J/Kg°K 5.elastic modulus (E-modulus) measured by ultrasonic through transmission mode is 7.2 GPa 6.all these test samples revealed good networked Ag interconnects along with 50% shrinkage porosities likely discontinuous type
