دورية أكاديمية
The Roadmap of 2D Materials and Devices Toward Chips
| العنوان: | The Roadmap of 2D Materials and Devices Toward Chips |
|---|---|
| المؤلفون: | Anhan Liu, Xiaowei Zhang, Ziyu Liu, Yuning Li, Xueyang Peng, Xin Li, Yue Qin, Chen Hu, Yanqing Qiu, Han Jiang, Yang Wang, Yifan Li, Jun Tang, Jun Liu, Hao Guo, Tao Deng, Songang Peng, He Tian, Tian-Ling Ren |
| المصدر: | Nano-Micro Letters, Vol 16, Iss 1, Pp 1-96 (2024) |
| بيانات النشر: | SpringerOpen, 2024. |
| سنة النشر: | 2024 |
| المجموعة: | LCC:Technology |
| مصطلحات موضوعية: | Two-dimensional materials, Roadmap, Integrated circuits, Post-Moore era, Technology |
| الوصف: | Highlights This review introduces the potential of 2D electronics for post-Moore era and discusses their current progress in digital circuits, analog circuits, heterogeneous integration, sensing circuits, artificial intelligence chips, and quantum chips in sequence. A comprehensive analysis of the current trends and challenges encountered in the development of 2D materials is summarized. An in-depth roadmap outlining the future development of 2D electronics is presented, and the most accessible and promising avenues for 2D electronics are suggested. |
| نوع الوثيقة: | article |
| وصف الملف: | electronic resource |
| اللغة: | English |
| تدمد: | 2311-6706 2150-5551 |
| Relation: | https://doaj.org/toc/2311-6706; https://doaj.org/toc/2150-5551 |
| DOI: | 10.1007/s40820-023-01273-5 |
| URL الوصول: | https://doaj.org/article/310f190895b3498ea432b3ebb33253d3 |
| رقم الأكسشن: | edsdoj.310f190895b3498ea432b3ebb33253d3 |
| قاعدة البيانات: | Directory of Open Access Journals |
Find this article in full text from Springer Verlag. 
Full Text Finder | تدمد: | 23116706 21505551 |
|---|---|
| DOI: | 10.1007/s40820-023-01273-5 |