دورية أكاديمية
Study on the Preparation and Performance of Low-Temperature Sintering and High-Thermal-Conductivity Silver Nanowire Film
| العنوان: | Study on the Preparation and Performance of Low-Temperature Sintering and High-Thermal-Conductivity Silver Nanowire Film |
|---|---|
| المؤلفون: | Yongqian Peng, Yicong Ye, Cuijuan Yu, Zhen Wang, Yuanxi Xu, Yongguo Du |
| المصدر: | Metals, Vol 13, Iss 4, p 819 (2023) |
| بيانات النشر: | MDPI AG, 2023. |
| سنة النشر: | 2023 |
| المجموعة: | LCC:Mining engineering. Metallurgy |
| مصطلحات موضوعية: | electronic packaging, nano-silver, low-temperature sintering, shear strength, high thermal conductivity, Mining engineering. Metallurgy, TN1-997 |
| الوصف: | This paper proposes a new silver nanoscale joining material, silver nanowire film, as an alternative joining approach for high-power and large-size chip packaging. The silver nanowire film was prepared by pressing filtration with silver nanowire that was synthesized using the polyol method. We found that the tensile strength of the film reached 3.40 MPa and the content of the silver reached up to 99.0 wt%. This paper further studies the influence of the size of silver nanowires on the performance of silver nanowire film. The experimental results show that the silver nanowire films prepared with silver nanowires with longer lengths and smaller diameters displayed better performances. The silver nanowire film with the best performance was prepared using silver nanowire with a diameter of 88 nm and a length of 29 μm. The thermal resistance of the sintered silver nanowire film that was hot-pressed at 250 °C 10 MPa was only 1.28 K∙W−1. The shear strength of the sintered joint was 56.4 MPa, and the fracture that occurred in the sintered silver nanowire film displayed a good plasticity. |
| نوع الوثيقة: | article |
| وصف الملف: | electronic resource |
| اللغة: | English |
| تدمد: | 2075-4701 96396156 |
| Relation: | https://www.mdpi.com/2075-4701/13/4/819; https://doaj.org/toc/2075-4701 |
| DOI: | 10.3390/met13040819 |
| URL الوصول: | https://doaj.org/article/62a364b3a92f40bf9639615654cbef08 |
| رقم الأكسشن: | edsdoj.62a364b3a92f40bf9639615654cbef08 |
| قاعدة البيانات: | Directory of Open Access Journals |
Full Text Finder | تدمد: | 20754701 96396156 |
|---|---|
| DOI: | 10.3390/met13040819 |