مؤتمر
A non-destructive inspection method for electronic packaging reliability incorporating mechanical and thermal information
العنوان: | A non-destructive inspection method for electronic packaging reliability incorporating mechanical and thermal information |
---|---|
المؤلفون: | Xiong, Chuanguo, Zeng, Baoshan, Huang, Yuhua, Zhu, Fulong |
المصدر: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :719-724 Dec, 2022 |
Relation: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
كن أول من يترك تعليقا!