مؤتمر
Comparative Study of Die-Attach Materials for LED Die Bonding
| العنوان: | Comparative Study of Die-Attach Materials for LED Die Bonding |
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| المؤلفون: | Hu, Liangxing, Bao, Shuyu, Wang, Yue, Kiat Goh, Simon Chun, Lim, Yu Dian, Zhao, Peng, Lim, Michael Joo Zhong, Miao, Weiyang, Dinh, Van Quy, Tan, Sai Choo, Chew, Kai Hwa, Tan, Chuan Seng |
| المصدر: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :447-451 Dec, 2022 |
| Relation: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350398854 9798350398847 |
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| DOI: | 10.1109/EPTC56328.2022.10013260 |