دورية أكاديمية
Deep Learning-Based Positioning Error Fault Diagnosis of Wire Bonding Equipment and an Empirical Study for IC Packaging
| العنوان: | Deep Learning-Based Positioning Error Fault Diagnosis of Wire Bonding Equipment and an Empirical Study for IC Packaging |
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| المؤلفون: | Kao, S., Chien, C. |
| المصدر: | IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 36(4):619-628 Nov, 2023 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 08946507 15582345 |
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| DOI: | 10.1109/TSM.2023.3243775 |