مؤتمر
Use of Printed Circuit Board as Filler in Composite Material: A Review
| العنوان: | Use of Printed Circuit Board as Filler in Composite Material: A Review |
|---|---|
| المؤلفون: | Sivamani, D, Vigneshw, Aran.K, Shyam, D, Ramkumar, R, Jay, Ashree.K, Lakshmi, Priya.M |
| المصدر: | 2022 International Conference on Computer, Power and Communications (ICCPC) Computer, Power and Communications (ICCPC), 2022 International Conference on. :488-493 Dec, 2022 |
| Relation: | 2022 International Conference on Computer, Power and Communications (ICCPC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350397840 9798350397833 |
|---|---|
| DOI: | 10.1109/ICCPC55978.2022.10072186 |