مؤتمر
Fabrication of High-speed Signal Transmission Rigid Substrate by Silver-seed Copper Plating Technique
| العنوان: | Fabrication of High-speed Signal Transmission Rigid Substrate by Silver-seed Copper Plating Technique |
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| المؤلفون: | Tamura, Rei, Fukazawa, Norimasa, Fujikawa, Wataru |
| المصدر: | 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :157-158 Apr, 2023 |
| Relation: | 2023 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9784991191152 |
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| DOI: | 10.23919/ICEP58572.2023.10129661 |