مؤتمر
Re-defining reliability assessment per new intra-via Cu leakage degradation
| العنوان: | Re-defining reliability assessment per new intra-via Cu leakage degradation |
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| المؤلفون: | Song, W.S., Lee, C.S., Park, K.C., Suh, B.S., Kim, J.W., Kim, S.Y., Wee, Y.J., Choi, S.M., Kang, H.-K., Kim, S.U., Suh, K.P. |
| المصدر: | 2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303) VLSI technology VLSI Technology, 2002. Digest of Technical Papers. 2002 Symposium on. :222-223 2002 |
| Relation: | 2002 Symposium on VLSI Technology Digest of Technical Papers |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 078037312X 9780780373129 |
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| DOI: | 10.1109/VLSIT.2002.1015462 |