التفاصيل البيبلوغرافية
| العنوان: |
Improving uniformity of 3-level High Aspect Ratio Supervias |
| المؤلفون: |
Montero, D., Marien, P., Hermans, Y., Vega-Gonzalez, V., Feurprier, Y., Oikawa, N., Buccheri, N., Wu, C., Martinez, G.T., Batuk, D., Puliyalil, H., Decoster, S., Kumar, K., Lazzarino, F., Murdoch, G., Park, S., Tokei, Z. |
| المصدر: |
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for. :1-3 May, 2023 |
| Relation: |
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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