Effect of Incorporation of Ceramic Nanoparticles in Bismuth-Tin Solder Paste on Electrochemical Migration

التفاصيل البيبلوغرافية
العنوان: Effect of Incorporation of Ceramic Nanoparticles in Bismuth-Tin Solder Paste on Electrochemical Migration
المؤلفون: Vesely, Petr, Fros, Denis, Klimtova, Marketa, Gharaibeh, Ali, Medgyes, Balint
المصدر: 2023 46th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2023 46th International Spring Seminar on. :1-6 May, 2023
Relation: 2023 46th International Spring Seminar on Electronics Technology (ISSE)
قاعدة البيانات: IEEE Xplore Digital Library