Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing

التفاصيل البيبلوغرافية
العنوان:	Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing
المؤلفون:	Hafez, W., Agnihotri, P., Asoro, M., Aykol, M., Bains, B., Bambery, R., Bapna, M., Barik, A., Chatterjee, A., Chiu, P.C., Chu, T., Firby, C., Fischer, K., Fradkin, M., Greve, H., Gupta, A., Haralson, E., Haran, M., Hicks, J., Illa, A., Jang, M., Klopcic, S., Kobrinsky, M., Kuns, B., Lai, H.-h., Lanni, G., Lee, S.-H., Lindert, N., Lo, C.-l., Luo, Y., Malyavanatham, G., Marinkovic, B., Maymon, Y., Nabors, M., Neirynck, J., Packan, P., Paliwal, A., Pantisano, L., Paulson, L., Penmatsa, P., Prasad, C., Puls, C., Rahman, T., Ramaswamy, R., Samant, S., Sell, B., Sethi, K., Shah, F., Shamanna, M., Shang, K., Li, Q., Sibakoti, M., Stoeger, J., Strutt, N., Thirugnanasambandam, R., Tsai, C., Wang, X., Wang, A., Wu, S.-j., Xu, Q., Zhong, X.-h., Natarajan, S.
المصدر:	2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023
Relation:	2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
قاعدة البيانات:	IEEE Xplore Digital Library