التفاصيل البيبلوغرافية
العنوان: |
Process Challenges During CVD Oxide Deposition on the Backside of $20-\mu m$ Thin 300-mm Wafers Temporarily Bonded to Glass Carriers |
المؤلفون: |
Kennes, Koen, Guerrero, Alice, Salahouelhadj, Abdellah, Suhard, Samuel, Derakhshandeh, Jaber, Phommahaxay, Alain, Brems, Steven, Beyer, Gerald, Beyne, Eric |
المصدر: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1584-1589 May, 2023 |
Relation: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |