التفاصيل البيبلوغرافية
| العنوان: |
Signal Integrity of 2-µm-Pitch RDL Interposer for High-Performance Signal Processing in Chiplet-Based System |
| المؤلفون: |
Kudo, Hiroshi, Tanaka, Masaya, Takano, Takamasa, Kuramochi, Satoru, Togashi, Kazuyoshi, Yoshimi, Seiichi |
| المصدر: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :531-536 May, 2023 |
| Relation: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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