التفاصيل البيبلوغرافية
| العنوان: |
High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer |
| المؤلفون: |
Lim, Teck Guan, Zho, Lin, Tippabhotla, Sasi Kumar, Lin, Ji, Chinq, Jong Ming, Wu, JiaQi, Gongyue, Tang, Ching, Eva Wai Leong, Ng, Yong Chyn, Chui, King Jien, Lu, Wei Jia, Goh, Chee Heng, Lin Pek, Sek, Loh, Jun Wei Agnes |
| المصدر: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1838-1843 May, 2023 |
| Relation: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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