Properties of low dielectric constant buildup materials containing micron sized hollow silica

التفاصيل البيبلوغرافية
العنوان: Properties of low dielectric constant buildup materials containing micron sized hollow silica
المؤلفون: Preeya, Kuray, Tom, McCarthy, Caleb, Ancharski, Yoji, Nakajima
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1260-1265 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350334982
تدمد:23775726
DOI:10.1109/ECTC51909.2023.00215