مؤتمر
Properties of low dielectric constant buildup materials containing micron sized hollow silica
العنوان: | Properties of low dielectric constant buildup materials containing micron sized hollow silica |
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المؤلفون: | Preeya, Kuray, Tom, McCarthy, Caleb, Ancharski, Yoji, Nakajima |
المصدر: | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1260-1265 May, 2023 |
Relation: | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9798350334982 |
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تدمد: | 23775726 |
DOI: | 10.1109/ECTC51909.2023.00215 |