التفاصيل البيبلوغرافية
| العنوان: |
A Thermally Friendly Bonding Scheme for 3D System Integration |
| المؤلفون: |
Kuo, Gordon, Chen, Chih-Yuan, Hsieh, Cheng-Chieh, Lee, Chung-Ju, Wu, Jason, Cui, Ji James, Kuo, Yen-Liang, Tung, Chih-Hang, Ku, Terry, Tsai, Chung-Hao, Yee, Kuo-Chung, Yu, Douglas C.H. |
| المصدر: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1973-1976 May, 2023 |
| Relation: |
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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