مؤتمر
3D Compact Thermal Model and its Application on Fast Chip Level Thermal Simulation
| العنوان: | 3D Compact Thermal Model and its Application on Fast Chip Level Thermal Simulation |
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| المؤلفون: | Cao, Zhizhu, Li, Jiming, Tao, Jun, Chen, Yu |
| المصدر: | 2023 International Symposium of Electronics Design Automation (ISEDA) Electronics Design Automation (ISEDA), 2023 International Symposium of. :246-249 May, 2023 |
| Relation: | 2023 International Symposium of Electronics Design Automation (ISEDA) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350304510 9798350304503 |
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| DOI: | 10.1109/ISEDA59274.2023.10218701 |