التفاصيل البيبلوغرافية
| العنوان: |
A Novel Milling Method in Integrated Heat Spreader Detachment to Preserve Surface Mount Devices in High Performance Product |
| المؤلفون: |
Goh, E., Azlan, M. Z., Chandra Mohan, S., Loh, S. C., Moo, Y. C., Chor, T. H. |
| المصدر: |
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-5 Jul, 2023 |
| Relation: |
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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