التفاصيل البيبلوغرافية
العنوان: |
Defect Isolation of Functional Failed 3D NAND Device Memory Using Memory Tester and Test Bench with OBIRCH |
المؤلفون: |
Lim, Yong Cheng, Gan, Yong Yang, Loke, Bee Chin |
المصدر: |
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-4 Jul, 2023 |
Relation: |
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
قاعدة البيانات: |
IEEE Xplore Digital Library |