مؤتمر
Bondwire Integration Challenges in E-band Systems: from PCB to Die Level
| العنوان: | Bondwire Integration Challenges in E-band Systems: from PCB to Die Level |
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| المؤلفون: | Zahran, Sherif R., Alati, Antonio, Marco, Raffaele De, Moscato, Stefano, Fonte, Alessandro, Amendola, G., Ferrari, Philippe, Boccia, Luigi |
| المصدر: | 2023 53rd European Microwave Conference (EuMC) Microwave Conference (EuMC), 2023 53rd European. :846-849 Sep, 2023 |
| Relation: | 2023 53rd European Microwave Conference (EuMC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9782874870729 |
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| DOI: | 10.23919/EuMC58039.2023.10290383 |