دورية أكاديمية
Derivation and Analysis of a Hemispherical Physical Model and the Correction Factors for the Sidewall Roughness of Through-Glass Vias
| العنوان: | Derivation and Analysis of a Hemispherical Physical Model and the Correction Factors for the Sidewall Roughness of Through-Glass Vias |
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| المؤلفون: | Fang, Z., Zhang, J., Gao, L., Li, S., Liu, J., Chen, H., Yang, X., Li, W., Cai, X., Cheng, Y. |
| المصدر: | IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 72(7):3908-3919 Jul, 2024 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 00189480 15579670 |
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| DOI: | 10.1109/TMTT.2023.3337382 |