دورية أكاديمية
PADS: Predictive Anomaly Detection for SMT Solder Joints Using Novel Features From SPI and Pre-AOI Data
| العنوان: | PADS: Predictive Anomaly Detection for SMT Solder Joints Using Novel Features From SPI and Pre-AOI Data |
|---|---|
| المؤلفون: | Cao, N., Won, D., Yoon, S.W. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(3):501-509 Mar, 2024 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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