33.7 An Adhesive Interposer-Based Reconfigurable Multi-Sensor Patch Interface with On-Chip Application Tunable Time-Domain Feature Extraction

التفاصيل البيبلوغرافية
العنوان:	33.7 An Adhesive Interposer-Based Reconfigurable Multi-Sensor Patch Interface with On-Chip Application Tunable Time-Domain Feature Extraction
المؤلفون:	Cho, Jeonghoon, Pyeon, You Jang, Yeom, Junyeong, Kim, Hyunjoong, Cho, Sanghyeon, Kim, Yonggi, Kim, Taejung, Kwak, Jong-Hyun, Choi, Geonjun, Lee, Yoonsik, Shin, Heungjoo, Jeong, Hoon Eui, Kim, Jae Joon
المصدر:	2024 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2024 IEEE International. 67:554-556 Feb, 2024
Relation:	2024 IEEE International Solid-State Circuits Conference (ISSCC)
قاعدة البيانات:	IEEE Xplore Digital Library