11.1 AMD InstinctTM MI300 Series Modular Chiplet Package – HPC and AI Accelerator for Exa-Class Systems

التفاصيل البيبلوغرافية
العنوان:	11.1 AMD InstinctTM MI300 Series Modular Chiplet Package – HPC and AI Accelerator for Exa-Class Systems
المؤلفون:	Smith, Alan, Chapman, Eric, Patel, Chintan, Swaminathan, Raja, Wuu, John, Huang, Tyrone, Jung, Wonjun, Kaganov, Alexander, McIntyre, Hugh, Mangaser, Ramon
المصدر:	2024 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2024 IEEE International. 67:490-492 Feb, 2024
Relation:	2024 IEEE International Solid-State Circuits Conference (ISSCC)
قاعدة البيانات:	IEEE Xplore Digital Library