مؤتمر
11.1 AMD InstinctTM MI300 Series Modular Chiplet Package – HPC and AI Accelerator for Exa-Class Systems
العنوان: | 11.1 AMD InstinctTM MI300 Series Modular Chiplet Package – HPC and AI Accelerator for Exa-Class Systems |
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المؤلفون: | Smith, Alan, Chapman, Eric, Patel, Chintan, Swaminathan, Raja, Wuu, John, Huang, Tyrone, Jung, Wonjun, Kaganov, Alexander, McIntyre, Hugh, Mangaser, Ramon |
المصدر: | 2024 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2024 IEEE International. 67:490-492 Feb, 2024 |
Relation: | 2024 IEEE International Solid-State Circuits Conference (ISSCC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
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