التفاصيل البيبلوغرافية
| العنوان: |
Development of Chip to Wafer Assembly with CuSnAg Microbump on Solder on Pad Interposer using Thermocompression and Solder Reflow |
| المؤلفون: |
Keng Yuen, Jason Au, Chong, Ser Choong, Daniel, Ismael Cereno |
| المصدر: |
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :94-99 Dec, 2023 |
| Relation: |
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
